Chemical mechanical polishing is a key process for achieving global and local planarization of wafers in the IC manufacturing process, in which Chemical mechanical polishing (CMP) slurries are the main processing chemicals used. According to the objects of polishing, ANJI’s chemical mechanical polishing slurries include copper polishing slurries, barrier polishing slurries, dielectric (silica-based and ceria-based abrasive) polishing slurries, tungsten polishing slurries, polishing slurries for various substrates, and polishing slurries for emerging materials and applications. Currently, ANJI’s copper and barrier polishing slurries can meet the needs of chip manufacturers in China and has achieved breakthroughs in overseas markets. Other series of polishing slurries have been supplied to numerous chip manufacturers in China and abroad, and their production scale will be adapted to the customer demand.
Functional electronic wet chemicals are formulated wet electronic chemicals that achieve specific functions in the IC manufacturing processes. Currently, ANJI offers post-etch residue remover (PERR), photoresist stripper, post CMP cleaning solution and other etchant products. PERR, photoresist stripper, and post CMP cleaning solution have been widely applied in volume production of 8 and 12 inch wafers in the IC manufacturing processes.
ECP is a process in which metal ions in the electrolyte are deposited on the cathode surface through electrochemical means. VMS (virgin makeup solution) and additives are the key processing materials in the process. Currently, ANJI offers a series of Copper, Nickel, Nickel-iron, and Tin-silver ECP products, providing solutions for integrated circuit front-end manufacturing and advanced packaging technology, such as through-silicon-via (TSV), bumping, and redistribution line (RDL) processes. They are widely applied in 6-, 8-, and 12-inch processes.